Workshop on Distributed Intelligence in the Computing Continuum

Workshop on Distributed Intelligence in the Computing Continuum (in conjunction with Global IoT Summit 2022 and the IoTWeek 2022
20-23 June 2022, Dublin, Ireland
Global IoT Summit 2022
IoTWeek 2022 

Important dates

Deadline for paper submission:  May 2, 2022
Date for notification: May 30, 2022
Camera Ready Submissions: June 15, 2022

Scope and motivation

The Internet of Things (IoT) is becoming an emerging topic with prevalent advancements in the development of hardware, software, and communication technologies.† The 2021 World Forum Artificial Intelligence and Machine Learning (AI/ML) focuses on how these advancements have impacted society and continue to evolve. The presence of connected devices for managed and platform services across the edge contributes to billions of IoT assets that provide observations and data measurements from the physical, which has facilitated the increase in the volume of collected data. AI/ML can provide insights from the data to further enhance the insights derived to support decision-making and the capabilities that IoT applications provide. AI/ML approaches are revolutionizing data exploitation in products, processes, and services to make it possible to find meaningful patterns and perform complex analysis.†
 

Topics of interest

Within this topic session, we discuss AI/ML technologies and applications that further drive the next generation of IoT. Some particular areas of interest include, but are not limited to:

  • Edge to Cloud Computing for IoT
  • Distributed Optimization for IoT
  • AI/ML and IoT in a 5G and Beyond context
  • Distributed Machine Learning for IoT
  • Edge AI/ML for IoT
  • Interpretable Machine Learning for IoT
  • Deep Learning for IoT applications
  • Reinforcement Learning for IoT applications
  • Optimized Machine Learning for IoT
  • Safe AI/ML for IoT

Submission instructions

All papers should be submitted via EDAS 
Submissions should be written in English, using standard LNCS format, with a maximum paper length of 12 printed pages including figures.
Full instructions on how to submit papers are provided here. 

Workshop CO-CHAIRS:
Vangelis Angelakis (Linköping University, Sweden)
Antonio Skarmeta (Universidad de Murcia, Spain)
Dirk Kutscher (University of Applied Sciences Emden/Leer, Germany)
Edgar Ramos (Ericsson, Finland)

Reviewers:
TBC