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Rommel Paulo Viloan




Rommel Paulo Viloan, Ulf Helmersson, Daniel Lundin (2021) Copper thin films deposited using different ion acceleration strategies in HiPIMS Surface & Coatings Technology, Vol. 422, Article 127487 Continue to DOI
Tetsuhide Shimizu, Kazuki Takahashi, Robert Boyd, Rommel Paulo Viloan, Julien Keraudy, Daniel Lundin, Ming Yang, Ulf Helmersson (2021) Low temperature growth of stress-free single phase alpha-W films using HiPIMS with synchronized pulsed substrate bias Journal of Applied Physics, Vol. 129, Article 155305 Continue to DOI
Rommel Paulo B. Viloan (2021) Engineered ion-bombardment as a tool in thin film deposition
Rommel Paulo B. Viloan, Michal Zaná┼íka, Daniel Lundin, Ulf Helmersson (2021) Pulse length selection for optimizing the accelerated ion flux fraction of a bipolar HiPIMS discharge Plasma sources science & technology, Vol. 29, Article 125013 Continue to DOI


Rommel Paulo B. Viloan, Daniel Lundin, Julien Keraudy, Ulf Helmersson (2020) Tuning the stress in TiN films by regulating the doubly charged ion fraction in a reactive HiPIMS discharge Journal of Applied Physics, Vol. 127, Article 103302 Continue to DOI