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Sanath Kumar Honnali

I work on energy-efficient physical vapor deposition methods (PVD) for hard coatings.

Research

My research aims to enhance PVD process efficiency through the elimination of substrate heating and cooling cycles during depositions. I leverage high-energy ion bombardment, achieved via high-power impulse magnetron sputtering (HiPIMS) technique.

One of the key advantages of HiPIMS is the ability to manipulate the materials arriving at workpiece through electric and magnetic fields, allowing better control over the film properties.

Publications

2025

Sanath Kumar Honnali, Robert Boyd, Roger Magnusson, Arnaud Le Febvrier, Daniel Lundin, Grzegorz Greczynski, Per Eklund (2025) Epitaxial growth of TiZrNbTaN films without external heating by high-power impulse magnetron sputtering Surface & Coatings Technology, Vol. 495, Article 131583 (Article in journal) Continue to DOI

2024

Niraj Kumar Singh, Victor Hjort, Sanath Kumar Honnali, Davide Gambino, Arnaud Le Febvrier, Ganpati Ramanath, Björn Alling, Per Eklund (2024) Effects of W alloying on the electronic structure, phase stability, and thermoelectric power factor in epitaxial CrN thin films Journal of Applied Physics, Vol. 136, Article 155301 (Article in journal) Continue to DOI
Susmita Chowdhury, Niraj Kumar Singh, Sanath Kumar Honnali, Grzegorz Greczynski, Per Eklund, Arnaud le Febvrier, Martin Magnuson (2024) Electronic structure and thermoelectric properties of epitaxial Sc1−xVxNy thin films grown on MgO(001) Physical Review B, Vol. 110, Article 115139 (Article in journal) Continue to DOI
Sanath Kumar Honnali (2024) Energy-efficient physical vapor deposition of transition metal nitride thin films
Daria Pankratova, Khabib Yusupov, Alberto Vomiero, Sanath Kumar Honnali, Robert Boyd, Daniele Fournier, Sebastian Ekeroth, Ulf Helmersson, Clio Azina, Arnaud Le Febvrier (2024) Enhanced Thermoelectric Properties by Embedding Fe Nanoparticles into CrN Films for Energy Harvesting Applications ACS Applied Nano Materials, Vol. 7, p. 3428-3435 (Article in journal) Continue to DOI