Motivation
In the past years, a major trend in electronics has been miniaturization, which has led to heat management issues due to significant Joule heating generated in microprocessors. Today, a new trend is emerging: flexible electronics, which aim to expand into new areas such as packaging, healthcare, intelligent industries, and smart cities. While many advancements are being made to make these devices flexible or small enough to integrate on flexible substrates, one key component is still missing: a flexible substrate with high thermal conductivity, made from sustainable materials and using eco-friendly production methods.
Solution
"2D-Paper" proposes to combine 2D materials and cellulose to create a new thermally conductive paper substrate for flexible electronics. In addition to developing this new material in the laboratory, we are using artificial intelligence to explore material combinations and optimize technical performance. Key performance factors include mechanical, dielectric, thermal, and electrical properties, with optical and chemical properties also being considered. Life cycle analysis and recyclability routes are being investigated, as these new substrates are intended for mass production and environmental interfacing.
Partners
In “2D-Paper”, we gather world experts of complementary skills, top notch infrastructure, from both academia and companies from Sweden, France and Slovenia to design, optimize, fabricate, characterize, and set technical specifications for flexible electronics, as well as make a proof of concept of a new thermally conducting paper substrates for flexible electronics; and specifically flexible thermoelectrics as an example of this revolutionary concept.
Links to our partners
University of Maribor; Department of mechanical engineering
Linköping University, Laboratory of Organic Electronics
Stockholm University, Department of Materials and Environmental Chemistry
ParsNord Thermoelectric Filial
Acknowledgements